In the below image is a rough description of a part that is plastic molded with two materials.
The blue part is injected first and then inserted in another mold (while still hot) and then the yellow part is injected on the blue part. This creates a chemical bondage, and also a mechanical interlocking mechanism both holds the two parts together.
I want to simulate this mechanism (at the end apply a load to a certain place in the part).
How is it best to model this chemical and mechanical mechanism in sol601?
The parts are very complex (not as simple as in the sketch below) and meshing them with continuous mesh is not feasble, so the only option I see is using glue contact.
From what ive seen so far there is no option to define the "strength" of the glue contact, what other means do I have to model this?
Does anyone have any idea what is the best way to model this?
Solved! Go to Solution.
I explored the capabilities of BGPARM command of NX NASTRAN in order to define the glue thermal Coupling contact, see http://iberisa.wordpress.com/2013/05/19/thermal-coupling-tutorial/
BGPARM is the nx nastran command with Control parameters for the glue algorithm. But BGPARM is not supported in SOL 601, although glue definitions (BGSET) are supported.
The mesh glueing feature of ADVANCED NONLINEAR MODULE (SOL601) is used to attach two surfaces (or lines in 2-D) together. These two surfaces usually involve different finite element meshes. The glueing procedure results in a smooth transition of displacements and tractions between the glued surfaces. Mesh glueing sets are defined in the BGSET entry, and the glued surfaces are defined via the BEDGE, BSURFS or BCPROPS entries.
The GLUE surface-to-surface is the best method, is "elegant" and accurate, do not produce hot spot results, as the use of RBE2 or SPRING elements feature used in old times, then not doubt, use it as much as possible!.
Thanks for the info.
Just a clarification - the glue contact is of infinite force? What I mean is, when I glue two solids, glue cannot "break" it is not the weak spot in the part (as in real world parts where when I glue two parts the glue is the weak point).
If this is the case, this means that there will never be separation between the two glued solids, and this is not true in my case.
Do you know if it is planned in the future to be able to control the glue parameters in SOL601?
Thanks for your time!
Please have clear the meaning of GLUE: joining together rigidly two components!!., not separation neither relative movement allowed. You need to select properly what face (or surface) runs as SOURCE (slave) and what face runs a TARGET (master), this is very important.
If one glue surface is smaller than the other, the smaller surface should preferably be the SOURCE (slave). However, the gluing will also work if the smaller surface is the TARGET (master). The two glued surfaces can also be partially overlapping.
Also, another good recommendation is to select as SOURCE (slave) region the surface with the fine mesh (and less rigid) and TARGET (master) the region with the coarse mesh (and more stiff).
In new NX NASTRAN V9.0 we have for SOL601 a new feature: GLUE EDGE-TO-EDGE, and also GLUE STIFFNESS OUTPUT in DMIG format, then I am sure in the future everything would be possible, please write and ENHANCED REQUEST with GTAC to make sure that SIEMENS heard your needs -- thanks!.
I knew that glue is rigid, just wanted to make sure I am correct, Thanks.
Where can I file an "enhanced request"?
Is it through the "create ncident report" in the help menu in FEMAP, if not where can I find the request form?