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Thermal Contact

Experimenter
Experimenter

I am a longtime MSC.Patran/Nastran user and just switched companies.  My new company uses Femap (11.2.2) and Autodesk Nastran (2016).  I am doing thermal analysis.  I am trying to create a thermal contact.  In Patran, under loads, you create a coupled convection and apply the heat transfer coefficient for the contact resistance.

 

Is there an equivalent operation in Femap that can be translated into Autodesk Nastran?

 

Thanks in advance,

 

David

2 REPLIES

Re: Thermal Contact

Solution Partner Phenom Solution Partner Phenom
Solution Partner Phenom

Dear David,

For Thermal contact take a look to my FEMAP Support web site where I explain the thermal coupling between PCB and Chip using the powerful GLUE Surface-to-Surface Contact capability of NX NASTRAN, is in the following address:

 

http://www.iberisa.com/soporte/femap/termico/Heat_Transfer_from_Chip_to_PCB.htm

 

Best regards,

Blas.

Blas Molero Hidalgo, Ingeniero Industrial, Director
IBERISA • 48004 BILBAO (SPAIN)
WEB: http://www.iberisa.com
Blog Femap-NX Nastran: http://iberisa.wordpress.com/

Re: Thermal Contact

Experimenter
Experimenter

Thanks, but I am using Autodesk Nastran.  The options closely resemble the NEi tab but it doesn't translate very well.