I am a longtime MSC.Patran/Nastran user and just switched companies. My new company uses Femap (11.2.2) and Autodesk Nastran (2016). I am doing thermal analysis. I am trying to create a thermal contact. In Patran, under loads, you create a coupled convection and apply the heat transfer coefficient for the contact resistance.
Is there an equivalent operation in Femap that can be translated into Autodesk Nastran?
Thanks in advance,
For Thermal contact take a look to my FEMAP Support web site where I explain the thermal coupling between PCB and Chip using the powerful GLUE Surface-to-Surface Contact capability of NX NASTRAN, is in the following address: