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thermal flow simulation

Solution Partner Pioneer Solution Partner Pioneer
Solution Partner Pioneer

hi,

 

i am trying to solve thermal flow analysis of electronic enclosure. i am getting error when i solve.

please help me why this error is coming and what is remedy for this error?

i have attached both model and error image.

 

 

thanks,

regards,

shreeharsha

2 REPLIES

Re: thermal flow simulation

Solution Partner Phenom Solution Partner Phenom
Solution Partner Phenom

Dear shreeharsha,

Uff, you have many errorrs here of "concept", better practice first with FEMAP/TMG FLOW tutorials to learn how to define CFD problems properly, this is basic, OK?. For instance, the AIR material properties are defined as ISOTROPIC, not as FLUID, then the error. Regarding geometry, you need to use command GEOMETRY > SOLID > EMBED to embed the CHIP & PCB in the electronics box, etc...

Best regards,
Blas.

Blas Molero Hidalgo, Ingeniero Industrial, Director
IBERISA • 48004 BILBAO (SPAIN)
WEB: http://www.iberisa.com
Blog Femap-NX Nastran: http://iberisa.wordpress.com/

Re: thermal flow simulation

Solution Partner Pioneer Solution Partner Pioneer
Solution Partner Pioneer

Thank you