I am a longtime MSC.Patran/Nastran user and just switched companies. My new company uses Femap (11.2.2) and Autodesk Nastran (2016). I am doing thermal analysis. I am trying to create a thermal contact. In Patran, under loads, you create a coupled convection and apply the heat transfer coefficient for the contact resistance.
Is there an equivalent operation in Femap that can be translated into Autodesk Nastran?
For Thermal contact take a look to my FEMAP Support web site where I explain the thermal coupling between PCB and Chip using the powerful GLUE Surface-to-Surface Contact capability of NX NASTRAN, is in the following address: