However, components of the system-level model may need to be analyzed in greater detail. In the case of the printed circuit board, a board-level analysis may include copper traces or detailed component models. How can one run a detailed thermal analysis of a sub-component, while reusing the convection results from the system level model?
Do this by importing the bulk heat transfer coefficient results from the CFD model into a spatially-varying convection to environment constraint in the thermal model:
a. Solve the CFD model, with the Local and Bulk Convection Coefficients results option activated.
b. Take note of the reference temperature for bulk heat transfer coefficients
c. In post processing display Bulk Convection Coefficients results (not the local results)
d. Identify the results on all faces of the geometry exposed to Fluid