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Re: Temperature distribution (SOL153) as temperature load (SOL101)

Siemens Phenom Siemens Phenom
Siemens Phenom

It's not for a lack of anything you did Thomas. It's not in the UI for NX 10, 11, or 12. It seems we haven't picked up the support for edge-face glue for SOL 153 in the pre-processing UI. You could use a copy/paste of text or include files to get a structural edge-face glue used in a thermal solution.

 

Regards,

Mark

Re: Temperature distribution (SOL153) as temperature load (SOL101)

Pioneer
Pioneer

Hi. Thank your for reply. I am not sure i follow. Keep in mind that I am at a basic level on NX CAE Smiley Happy

 

First I thought you meant by copy/paste text it was to modify the thermal input file by including the BGSET card with edge-to-surface copied from the SOL101 dat file to SOL153 dat file. So I copy the text from SOL101.dat file and used write-edit-solve on SOL153 and modify SOL153.dat file before running the simulation.

 

But it looks like that did not have any much effect Smiley Happy

 

Thomas