Is it possible to extract thermal capacitance matrix and thermal conductivity matrix in an transient thermal analysis?
If yes, how can I do that?
Thanks for your question. My understanding is that you would like to take time-temperature data from a test of a chip and use that data to generate an RC model (Foster or Cauer network)?
This process is not automated in Simcenter STAR-CCM+, however it can be done by post-processing the simulation results (see for example the process explained in http://analysistech.com/wp-content/uploads/2017/02/ComponentChar11-2011.pdf)
If you would like to discuss this question in detail, I would recommend contacting your support engineer via the Customer Portal.