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Maya HTT: Simcenter Multi physics Workflow for BGA and Creep Solder Reliability

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Siemens Visionary

detroit event collateral.jpgThe information below was gathered from the 2018 Simcenter Conference - Americas that took place October 15-17 in Detroit, Michigan.

 

Author: Zouya Zarei, Thermal Flow Application Engineering

 

The ball grid array (BGA) is a common surface mounting approach for electronics packages. It is an elegant solution to a number of manufacturing requirements, allowing dense packing of connections between the package and the printed circuit board (PCB), improved heat conduction and lower inductance (reduces signal distortion). However, the difference in the thermal and mechanical characteristics of the solder and the PCB can lead to solder failure when the assembly is subject to flexure, vibration, or repeated thermal cycles. Detecting and repairing solder faults requires expensive equipment and processes.